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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9953894 B1

PDFFull Text
Expired
Date of Patent:
Apr. 24, 2018

Filed:

Mar. 01, 2017

Semiconductor device and manufacturing method thereof

Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;

Inventors:

Shingo Masuko, Ishikawa, JP;

Yoshiharu Takada, Ishikawa, JP;

Kazuo Fujimura, Ishikawa, JP;

Assignee:

KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Mark Prenty

Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 29/08 (2006.01); H01L 29/417 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); H01L 23/544 (2006.01); H01L 21/78 (2006.01); H01L 21/304 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/02164 (2013.01); H01L 21/304 (2013.01); H01L 21/31116 (2013.01); H01L 21/4882 (2013.01); H01L 21/78 (2013.01); H01L 23/3736 (2013.01); H01L 23/544 (2013.01); H01L 29/0847 (2013.01); H01L 29/41775 (2013.01); H01L 2223/54453 (2013.01);
Abstract

A semiconductor device including: a semiconductor element, a substrate having a first surface on which the semiconductor element is provided, and a second surface located opposite the first surface, a metal species provided on the second surface, and a plated metal portion provided at least in part on the second surface on the metal species. The semiconductor device further includes a first region where the plated metal portion is provided and a second region where the plated metal portion is not provided are alternately arranged at a peripheral portion of the second surface.

Find Patent Forward Citations

Masuko, Shingo. (2018). Semiconductor device and manufacturing method thereof (U.S. Patent No. 9953894). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9953894

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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