The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Nov. 02, 2016
Applicant:

Abb Technology Oy, Helsinki, FI;

Inventors:

Jorma Manninen, Vantaa, FI;

Pirkka Myllykoski, Helsinki, FI;

Assignee:

ABB Technology Oy, Helsinki, FI;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/42 (2006.01); H01L 25/07 (2006.01); H01L 29/73 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); H01L 25/00 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3672 (2013.01); H01L 21/4882 (2013.01); H01L 23/3735 (2013.01); H01L 23/3736 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); H01L 25/07 (2013.01); H01L 25/50 (2013.01); H01L 29/7393 (2013.01);
Abstract

A method of producing a power electronic assembly and a power electronic assembly including a power electronic module incorporating multiple of semiconductor power electronic switch components, the power electronic module including a base plate with a bottom surface, the power electronic assembly includes further a cooling arrangement for cooling the power electronic module, the cooling arrangement including a cooling surface adapted to be attached against the bottom surface of the base plate of the power electronic module, wherein the power electronic assembly includes further a thermal interface material arranged between the bottom surface of the base plate of the power electronic module and the cooling surface of the cooling arrangement to transfer heat from the power electronic module to the cooling arrangement, the thermal interface material includes a metal foil and a solid lubricant coating.


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