The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Jul. 11, 2016
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Jiping Li, Palo Alto, CA (US);
Aaron Muir Hunter, Santa Cruz, CA (US);
Bruce E. Adams, Portland, OR (US);
Kim Vellore, San Jose, CA (US);
Samuel C. Howells, Portland, OR (US);
Stephen Moffatt, St. Brelade, JE;
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/20 (2006.01); H01L 21/36 (2006.01); H01L 21/26 (2006.01); H01L 21/42 (2006.01); H01L 21/44 (2006.01); H01L 21/67 (2006.01); H01L 21/268 (2006.01); B23K 26/00 (2014.01); B23K 26/03 (2006.01); B23K 26/0622 (2014.01); B23K 26/066 (2014.01); H01L 21/324 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67115 (2013.01); B23K 26/009 (2013.01); B23K 26/0066 (2013.01); B23K 26/034 (2013.01); B23K 26/066 (2015.10); B23K 26/0622 (2015.10); H01L 21/268 (2013.01); H01L 21/324 (2013.01); B23K 2201/40 (2013.01);
Abstract
Embodiments described herein relate to apparatus and methods of thermal processing. More specifically, apparatus and methods described herein relate to laser thermal treatment of semiconductor substrates by increasing the uniformity of energy distribution in an image at a surface of a substrate.