The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Feb. 10, 2017
Applicant:

Western Digital Technologies, Inc., Irvine, CA (US);

Inventor:

Tzong-Shii Pan, San Jose, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); G11B 5/48 (2006.01);
U.S. Cl.
CPC ...
G11B 5/4846 (2013.01); G11B 5/486 (2013.01); G11B 5/4826 (2013.01); G11B 5/4833 (2013.01); G11B 5/4853 (2013.01); Y10T 29/49057 (2015.01); Y10T 29/53261 (2015.01);
Abstract

A head gimbal assembly has a laminate flexure that includes a metallic conductive layer that includes a plurality of electrically conductive traces that are elongated and narrow and electrically connected to the read head, and a metallic structural layer that is stiffer than the conductive layer. A first dielectric layer is disposed between the structural layer and the conductive layer. A second dielectric layer substantially covers the conductive layer in a flexure tail bonding region that overlaps a flexible printed circuit (FPC). The structural layer includes a plurality of flexure bond pads that are aligned with, facing, and bonded to corresponding FPC bond pads. The flexure bond pads in the structural layer are electrically connected to the electrically conductive traces in the conductive layer by vias through the first dielectric layer. In certain embodiments, the flexure tail is folded upon itself in the flexure tail bonding region.


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