The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Aug. 04, 2016
Applicant:
Shunsin Technology (Zhong Shan) Limited, Zhongshan, CN;
Inventor:
Jun Yang, Zhongshan, CN;
Assignee:
SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED, Zhongshan, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01); H05K 3/32 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
G06K 9/00053 (2013.01); H05K 1/0281 (2013.01); H05K 1/142 (2013.01); H05K 1/181 (2013.01); H05K 1/189 (2013.01); H05K 3/0044 (2013.01); H05K 3/303 (2013.01); H05K 3/328 (2013.01); H05K 3/361 (2013.01); H05K 2201/10151 (2013.01);
Abstract
A fingerprint sensor package includes a substrate, a fingerprint sensor chip, and a flexible printed circuit board (FPC). The substrate includes a first portion and a second portion. A line layer is disposed on the first portion. The fingerprint sensor chip is disposed on the substrate. The fingerprint sensor chip is electrically connected to the FPC by the line layer. The package is simple, reliable, and easy for manufacturing process, reducing materials and processing costs.