The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Nov. 20, 2014
Applicant:

Bae Systems Plc, London, GB;

Inventors:

Mark David Balmond, Filton, GB;

Alexander Roy Parfitt, Filton, GB;

Gary David Panaghiston, Chelmsford, GB;

Larry Brian Tween, Chelmsford, GB;

Christopher Colin Figgures, Filton, GB;

Assignee:

BAE Systems plc, London, GB;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 17/04 (2006.01); B29C 45/14 (2006.01); B29C 45/16 (2006.01); B29C 45/34 (2006.01); B64D 45/00 (2006.01); G01N 27/04 (2006.01); B29K 79/00 (2006.01); B29K 305/02 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
G01N 17/04 (2013.01); B29C 45/14655 (2013.01); B29C 45/14836 (2013.01); B29C 45/1671 (2013.01); B29C 45/34 (2013.01); B64D 45/00 (2013.01); G01N 27/041 (2013.01); B29C 2045/14844 (2013.01); B29C 2791/006 (2013.01); B29K 2079/08 (2013.01); B29K 2305/02 (2013.01); B29L 2031/3481 (2013.01); B64D 2045/0085 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01);
Abstract

A sensor () and a method of manufacturing the sensor (), the sensor () including a number of metallic strips () mounted on a non-conducting substrate () and a module () for forming electrical connections to the strips () whereby to enable communication between the strips () and monitoring equipment for the sensor (), the module including a number of wire connections (), the method including the steps of encapsulating the wire connections within a flexible chemical and heat resistant sealing compound, and subsequently, encapsulating the flexible sealing compound within a second sealing compound () by an injection molding process.


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