The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Oct. 03, 2016
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Timothy C. Shaw, Austin, TX (US);

Flavio P. Ribeiro, Bellevue, WA (US);

Glennis E. Covington, Redmond, WA (US);

Christian C. Gadke, Lake Oswego, OR (US);

Xuezhong Wu, Bellevue, WA (US);

Bradley R. Martin, Auburn, WA (US);

Francie Judith Zant, Seattle, WA (US);

Scott M. Mail, Seattle, WA (US);

James C. Marshall, Puyallup, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); G01L 1/14 (2006.01); G06F 3/02 (2006.01); G06F 3/041 (2006.01); G06F 3/044 (2006.01); H01H 13/702 (2006.01); H01H 13/83 (2006.01); G06F 1/32 (2006.01);
U.S. Cl.
CPC ...
G01L 1/146 (2013.01); G06F 1/1632 (2013.01); G06F 1/1669 (2013.01); G06F 3/0202 (2013.01); G06F 3/044 (2013.01); G06F 3/0414 (2013.01); G06F 1/3215 (2013.01); G06F 2203/04105 (2013.01); G06F 2203/04106 (2013.01); G06F 2203/04108 (2013.01); H01H 13/702 (2013.01); H01H 13/83 (2013.01); H01H 2211/012 (2013.01); H01H 2211/032 (2013.01); H01H 2219/028 (2013.01); H01H 2219/03 (2013.01); H01H 2219/062 (2013.01); H01H 2221/002 (2013.01); H01H 2221/05 (2013.01);
Abstract

Input device configurations are described. In implementations, an input device includes a sensor substrate having a capacitive sensor to detect proximity of an object that contacts the input device. The input device also includes a flexible contact layer spaced apart from the sensor substrate, where the flexible contact layer is implemented to flex and contact the sensor substrate responsive to pressure applied by the object to initiate an input to a computing device. The flexible contact layer can include a force concentrator pad that is designed to cause pressure to be channeled through the force concentrator pad to cause the flexible contact layer to contact the sensor substrate to initiate the input.


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