The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Nov. 18, 2013
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;
Tsutomu Kono, Tokyo, JP;
Keiji Hanzawa, Ibaraki, JP;
Noboru Tokuyasu, Ibaraki, JP;
Shinobu Tashiro, Ibaraki, JP;
Hiroki Nakatsuchi, Tokyo, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
When an exposed part of a semiconductor chip is reduced in size, a tendency of development of a crack on the semiconductor chip is suppressed. A pressure of injection of a resin MR into a second space creates a gap on a contact part SEL where an elastic film LAF and a semiconductor chip CHPare in contact, and a resin MRdifferent in constituent from the resin MR infiltrates into the gap. As a result, in an area of semiconductor chip CHPthat is exposed from the resin MR, the resin MRis formed in an area other than a flow detecting unit FDU and an area around it. Hence, an area of semiconductor chip CHPthat is exposed from the resins MR and MRcan be reduced in size.