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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9951433 B1

PDFFull Text
Date of Patent:
Apr. 24, 2018

Filed:

Nov. 18, 2014

Conductive film-forming bath

Applicant:

Okuno Chemical Industries Co., Ltd., Osaka-shi, Osaka, JP;

Inventors:

Yukiya Takeuchi, Osaka, JP;

Junji Yoshikawa, Osaka, JP;

Koji Kita, Osaka, JP;

Assignee:

OKUNO CHEMICAL INDUSTRIES CO., LTD., Osaka-shi, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Helene Klemanski

Int. Cl.
CPC ...
C23C 18/40 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); C23C 18/24 (2006.01); C23C 18/28 (2006.01); C23C 18/30 (2006.01); C25D 3/38 (2006.01); C25D 3/04 (2006.01); C25D 3/12 (2006.01); C25D 5/14 (2006.01); C25D 5/34 (2006.01); C25D 5/54 (2006.01); C25D 1/18 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01); C23C 18/16 (2013.01); C23C 18/1653 (2013.01); C23C 18/2086 (2013.01); C23C 18/40 (2013.01); C25D 3/04 (2013.01); C25D 3/12 (2013.01); C23C 18/285 (2013.01); C23C 18/30 (2013.01); C25D 5/14 (2013.01);
Abstract

An object of the present invention is to provide a novel conductive film-forming bath comprising an alkaline aqueous solution that can be used to form a film by electroplating on a non-conductive plastic material, the conductive film-forming bath being capable of forming a film by electroplating that has an excellent appearance and that does not suffer from reduced adhesiveness with respect to a non-conductive plastic material. The present invention relates to a conductive film-forming bath comprising an aqueous solution containing a copper compound, a complexing agent, an alkali metal hydroxide, and a water-soluble polymer having a polyoxyalkylene structure.

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