The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Jan. 22, 2015
Applicant:

Yushin Co., Ltd., Niigata, JP;

Inventor:

Katsunori Futase, Niigata, JP;

Assignee:

YUSHIN CO., LTD., Niigata, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65B 31/00 (2006.01); B65B 9/08 (2012.01); B65B 7/02 (2006.01); B65D 75/58 (2006.01); B65B 51/10 (2006.01); B65B 31/04 (2006.01); B65B 55/00 (2006.01); B65B 61/18 (2006.01); B65B 9/06 (2012.01); B65B 51/30 (2006.01);
U.S. Cl.
CPC ...
B65B 31/00 (2013.01); B65B 7/02 (2013.01); B65B 9/06 (2013.01); B65B 9/08 (2013.01); B65B 31/045 (2013.01); B65B 51/10 (2013.01); B65B 55/00 (2013.01); B65B 61/186 (2013.01); B65D 75/5883 (2013.01); B65B 51/306 (2013.01);
Abstract

A method for filling and packing a gas and a liquid material by filling the gas in an amount corresponding to 2-40 vol % of the volume of the liquid material together with the liquid material into a package bag composed of plastic films through an unsealed opening portion thereof and then sealing the unsealed opening portion by heat sealing, characterized in that the gas is previously dispersed and incorporated in form of microbubbles having a diameter of not more than 50 μm in to the liquid material and filled into in the package bag at a state of microbubble-containing liquid material, or the gas is filled while generating as microbubbles having a diameter of not more than 50 μm in the liquid material previously supplied to the package bag.


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