The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Apr. 03, 2015
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventors:

Makoto Adachi, Susono, JP;

Naoki Takehiro, Shizuoka-ken, JP;

Keiichi Kaneko, Mishima, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/88 (2006.01); B01J 23/44 (2006.01); B01J 37/04 (2006.01); B01J 35/02 (2006.01); B01J 37/02 (2006.01); H01M 4/92 (2006.01);
U.S. Cl.
CPC ...
B01J 23/44 (2013.01); B01J 35/02 (2013.01); B01J 35/026 (2013.01); B01J 37/02 (2013.01); B01J 37/0221 (2013.01); B01J 37/04 (2013.01); H01M 4/88 (2013.01); H01M 4/8853 (2013.01); H01M 4/92 (2013.01); H01M 4/926 (2013.01);
Abstract

The present invention is to provide fine catalyst particles to which sulfate ions are less likely to be adsorbed, and a carbon-supported catalyst to which sulfate ions are less likely to be adsorbed. Disclosed is a method for producing fine catalyst particles comprising a fine palladium-containing particle and a platinum-containing outermost layer covering at least part of the fine palladium-containing particle, wherein the method comprises: a copper covering step of covering at least part of the fine palladium-containing particle with copper by preparing a second dispersion by mixing a first dispersion comprising fine palladium-containing particles being dispersed in an acid solution with a copper-containing solution, and applying a potential that is nobler than the oxidation reduction potential of copper to the fine palladium-containing particles in the second dispersion, and a platinum covering step of covering at least part of the fine palladium-containing particle with platinum by substituting the copper covering at least part of the fine palladium-containing particle with platinum by mixing the second dispersion and a platinum-containing solution after the copper covering step, with applying a constant potential that is in a range between a potential that is nobler than the oxidation reduction potential of copper and a potential that is less than the oxidation reduction potential of platinum, to the fine palladium-containing particles.


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