The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Sep. 22, 2017
Applicant:

Stryker Corporation, Kalamazoo, MI (US);

Inventors:

Robert Brindley, Delton, MI (US);

John Janik, Hudsonville, MI (US);

Edward Chia-Ning Tang, Ann Arbor, MI (US);

James Bernard Dunlop, Colorado Springs, CO (US);

Joseph Leland Spangler, Manitou Springs, CO (US);

Assignee:

STRYKER CORPORATION, Kalamazoo, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/05 (2006.01); A61N 1/08 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
A61N 1/05 (2013.01); A61N 1/0553 (2013.01); A61N 1/08 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/211 (2013.01); H01L 2224/2101 (2013.01); H01L 2224/215 (2013.01); H01L 2224/221 (2013.01); H01L 2224/24227 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15165 (2013.01); H01L 2924/15787 (2013.01); H05K 1/118 (2013.01); H05K 1/185 (2013.01);
Abstract

A method of forming an implantable electrode array that includes one or more packaged control modules. A control module is packaged by mounting the module to a substrate and forming a containment ring around the module. A conformal coating is disposed over the surface of the module to cover the carrier. Within the containment ring, the conformal coating hardens to form a non-porous shell around the control module. The one or more packaged control modules are placed in a flexible array. Electrodes that are mounted to or embedded in the flexible carrier are connected to the one or more control modules.


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