The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

May. 02, 2017
Applicant:

Omron Corporation, Kyoto, JP;

Inventors:

Yuki Ushiro, Ayabe, JP;

Takaaki Sanda, Fukuchiyama, JP;

Daisuke Inoue, Ayabe, JP;

Eiji Teramoto, Kusatsu, JP;

Makoto Sugimoto, Ayabe, JP;

Assignee:

OMRON Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/055 (2006.01); H05K 5/02 (2006.01); H01B 7/282 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0247 (2013.01); H01B 7/2825 (2013.01); H05K 1/18 (2013.01); H05K 2201/10106 (2013.01);
Abstract

An electronic apparatus includes a case, a cable drawn out from the case, a bonding intermediating member, a cylindrical clamp holding the cable, and a sealing part filling an internal space defined by the case and the clamp. The cable has a core wire and a sheath covering the core wire, and the core wire is exposed at an end of the cable without being covered by the sheath. The bonding intermediating member is bonded to the sheath and the sealing part. The sealing part is formed of an epoxy resin, the bonding intermediating part is formed of a resin having a bending elastic modulus in the range of 80 MPa to 210 MPa, and the cable is formed of a material having a suspending flattening ratio in the range of 0.30 to 0.71.


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