The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Apr. 14, 2014
Applicant:

Presidio Components, Inc., San Diego, CA (US);

Inventor:

Hung Van Trinh, La Jolla, CA (US);

Assignee:

Presidio Components, Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H05K 3/34 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01G 2/06 (2006.01); B23K 1/00 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); H01G 4/38 (2006.01); H01G 4/232 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3426 (2013.01); B23K 1/0016 (2013.01); B23K 35/262 (2013.01); C22C 13/00 (2013.01); H01G 2/06 (2013.01); H01G 4/232 (2013.01); H01G 4/2325 (2013.01); H01G 4/38 (2013.01); H01L 23/495 (2013.01); H01L 23/498 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 23/562 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10628 (2013.01); H05K 2201/10787 (2013.01); H05K 2203/047 (2013.01); H05K 2203/1173 (2013.01); H05K 2203/1377 (2013.01); Y02P 70/613 (2015.11);
Abstract

An electrical device for soldering to a circuit board with a solder includes a capacitor, a lead frame including a solder dam, and a solder joint electrically coupling the capacitor to the lead frame. The solder dam includes one of a physical barrier to flow or an area of reduced wettability to the solder. The solder dam is between the solder joint and the circuit board. The solder dam is on one or both of a lead portion and main portion of the lead frame. In one embodiment, the first solder dam extends substantially the full width of the first lead portion. The solder dam may be a barrier and/or include a metal oxide. A method of manufacturing the device includes soldering a lead frame to a capacitor with a solder and modifying a surface on the lead frame to include a physical barrier and/or an area of reduced wettability.


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