The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Jan. 18, 2017
Applicant:

Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd., Zhuhai, CN;

Inventors:

Dror Hurwitz, Zhuhai, CN;

Alex Huang, Zhuhai, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); H05K 1/0313 (2013.01); H05K 1/115 (2013.01); H05K 3/0064 (2013.01); H05K 3/064 (2013.01); H05K 2201/032 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/10242 (2013.01);
Abstract

An array of chip sockets defined by an organic matrix framework surrounding sockets through the organic matrix framework and further comprising a grid of metal vias through the organic matrix framework. In an embodiment, a panel includes an array of chip sockets, each surrounded and defined by an organic matrix framework including a grid of copper vias through the organic matrix framework. The panel includes at least a first region with sockets having a set of dimensions for receiving one type of chip and a second region with sockets and another set of dimensions for receiving a second type of chip.


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