The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2018
Filed:
Jun. 03, 2016
Applicant:
Starkey Laboratories, Inc., Eden Prairie, MN (US);
Inventors:
Sidney A. Higgins, Maple Grove, MN (US);
John Becker, Delano, MN (US);
Thomas Bartosh, Minneapolis, MN (US);
Joel Erdman, Waconia, MN (US);
Assignee:
Starkey Laboratories, Inc., Eden Prairie, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01); H04R 31/00 (2006.01); H04R 19/04 (2006.01); H04R 1/04 (2006.01);
U.S. Cl.
CPC ...
H04R 31/006 (2013.01); H04R 1/04 (2013.01); H04R 19/04 (2013.01); H04R 31/003 (2013.01); H04R 25/604 (2013.01); H04R 2201/003 (2013.01); H04R 2201/029 (2013.01);
Abstract
Described are techniques for creating acoustic inlet manifolds for a microphone that utilize existing flex or printed circuit board (PCB) technology to create an ultra-low profile manifold. The described techniques: take advantage of the ability to allow reflow connection. By embedding an acoustic path between the layers or creating an acoustic path on the surface of a flex or PCB assembly, the microphone can be reflowed onto the manifold assembly.