The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Nov. 20, 2017
Applicant:

Advanced-connectek Inc., New Taipei, TW;

Inventors:

Ching-Tien Chen, New Taipei, TW;

Shu-Lin Duan, New Taipei, TW;

Wei Wan, New Taipei, TW;

Fu-Yi Xu, New Taipei, TW;

Assignee:

Advanced-Connectek Inc., New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/648 (2006.01); H01R 24/62 (2011.01); H01R 13/6594 (2011.01); H01R 13/6585 (2011.01);
U.S. Cl.
CPC ...
H01R 24/62 (2013.01); H01R 13/6585 (2013.01); H01R 13/6594 (2013.01);
Abstract

An electrical receptacle connector includes a metallic shell, an insulated housing received in the metallic shell, receptacle terminals, and a grounding plate. The receptacle terminals and the grounding plate are at the insulated housing. The insulated housing includes a base portion and a tongue portion extending from the base portion. The grounding plate includes a plate body, extension arms, and contact regions. The front of the plate body is near to a front lateral surface of the tongue portion, and the rear of the plate body is extending to the base portion. The plate body is between the receptacle terminals. The extension arms are extending from the plate body. The contact regions are formed on the extension arms and in contact with an inner wall of the shell body. Accordingly, the grounding plate is in contact with the metallic shell for providing grounding and reducing the electromagnetic interference.


Find Patent Forward Citations

Loading…