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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9947836 B1

PDFFull Text
Date of Patent:
Apr. 17, 2018

Filed:

Mar. 26, 2015

Electronic device mounting substrate and electronic apparatus

Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Mitsuharu Sakai, Kyoto, JP;

Shou Yamasaki, Kyoto, JP;

Shigetoshi Inuyama, Kyoto, JP;

Noritaka Niino, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Mark Tornow

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 23/053 (2006.01); H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 23/498 (2006.01); H01L 31/0232 (2014.01); H01L 33/58 (2010.01); H01L 31/02 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/483 (2013.01); H01L 23/053 (2013.01); H01L 23/49822 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14636 (2013.01); H01L 31/02002 (2013.01); H01L 31/0203 (2013.01); H01L 31/02325 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01);
Abstract

An electronic device mounting substrate includes: a first wiring substrate shaped in a rectangular frame, an interior of the rectangular frame constituting a first through hole; a second wiring substrate shaped in a rectangular frame or plate, the second wiring substrate being disposed so as to overlie a lower surface of the first wiring substrate and be electrically connected to the first wiring substrate; a metallic plate disposed so as to overlie a lower surface of the second wiring substrate so that the second wiring substrate is sandwiched between the metallic plate and the first wiring substrate; and a lens holder secured to an outer periphery of the metallic plate. A frame interior of the first wiring substrate, or a frame interior of each of the first wiring substrate and the second wiring substrate, constitutes an electronic device mounting space.

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