The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Oct. 18, 2016
Applicants:

Chan-long Shieh, Paradise Valley, AZ (US);

Gang Yu, Santa Barbara, CA (US);

Guangming Wang, Santa Barbara, CA (US);

Inventors:

Chan-Long Shieh, Paradise Valley, AZ (US);

Gang Yu, Santa Barbara, CA (US);

Guangming Wang, Santa Barbara, CA (US);

Assignee:

CBRITE INC., Goleta, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14616 (2013.01); H01L 27/1463 (2013.01); H01L 27/1469 (2013.01); H01L 27/14643 (2013.01); H01L 27/14689 (2013.01); H01L 27/14692 (2013.01);
Abstract

A method of fabricating a structure including a high mobility backplane and a-Si photodiode imager includes forming a matrix of metal oxide thin film transistors on the surface of a rigid support member, depositing a planarizing layer on the matrix of transistors that is either porous or permissive/diffusive to oxygen at temperatures below approximately 200° C., and fabricating a matrix of passivated a-Si photodiodes over the matrix of transistors and electrically connected one each photodiode to each of the transistors. A continuous path is provided through the planarizing layer from the exterior of the structure to each of the transistors and the structure is annealed at a temperature below 200° C. in an oxygen ambient to move oxygen from the oxygen ambient to an active layer of each of the transistors and repair loss of oxygen damage to the transistors caused by the fabrication of the passivated a-Si photodiodes.


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