The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2018
Filed:
Nov. 08, 2016
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 24/96 (2013.01); H01L 21/561 (2013.01); H01L 23/3128 (2013.01); H01L 23/373 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68386 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/13024 (2013.01);
Abstract
A support substrate, a method of manufacturing a semiconductor package, and a semiconductor package, the support substrate including a first plate; a second plate on the first plate; and an adhesive layer between the first plate and the second plate, wherein a coefficient of thermal expansion (CTE) of the adhesive layer is higher than a CTE of the first plate and higher than a CTE of the second plate.