The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2018
Filed:
Jan. 12, 2016
Rohm Co., Ltd., Kyoto, JP;
Mamoru Yamagami, Kyoto, JP;
Yasuhiro Fuwa, Kyoto, JP;
ROHM CO., LTD., Kyoto, JP;
Abstract
The present invention provides a semiconductor device and a method for manufacturing a semiconductor device. The method comprises: Preparing a semiconductor chipwith a first electrode layerformed on an element-forming surface. Prepared a support memberhaving a conductorformed on a pattern-forming surface. The first electrode layeris bonded to the conductorby a solder, and thus the semiconductor chipis fixed on the support member. While the semiconductor chipis fixed on the support member, the semiconductor chipis coated by the sealing resinto form a sealing structure. By removing the support memberfrom the sealing structure, the conductorformed on the support memberis transferred to the sealing structure. The conductortransferred to the sealing structureis an external electrode exposed from the sealing structure