The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Aug. 19, 2016
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Brett W. Degner, Menlo Park, CA (US);

William F. Leggett, San Francisco, CA (US);

Jay S. Nigen, Mountain View, CA (US);

Frank F. Liang, San Jose, CA (US);

Richard H. Tan, Fremont, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H05K 5/00 (2006.01); F28D 15/00 (2006.01); G06F 1/20 (2006.01); H05K 5/02 (2006.01); F28D 15/02 (2006.01); B23P 15/26 (2006.01); H05K 7/20 (2006.01); F28D 15/04 (2006.01); F28D 1/02 (2006.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01); B23P 15/26 (2013.01); F28D 15/02 (2013.01); F28D 15/0233 (2013.01); F28D 15/0275 (2013.01); F28D 15/04 (2013.01); H05K 5/02 (2013.01); H05K 7/20309 (2013.01); H05K 7/20318 (2013.01); H05K 7/20336 (2013.01); F28D 1/024 (2013.01); Y10T 29/49826 (2015.01);
Abstract

The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.


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