The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Jun. 03, 2015
Applicant:

Flir Systems, Inc., Wilsonville, OR (US);

Inventors:

Robert F. Cannata, Santa Barbara, CA (US);

Kevin Peters, Santa Barbara, CA (US);

Patrick Franklin, Santa Barbara, CA (US);

Eric A. Kurth, Santa Barbara, CA (US);

James L. Dale, Pocatello, ID (US);

Tommy Marx, Santa Barbara, CA (US);

Craig Shott, Santa Barbara, CA (US);

Reza Salafian, Santa Barbara, CA (US);

Richard E. Bornfreund, Santa Barbara, CA (US);

Saumya Kothari, Charlotte, NC (US);

Assignee:

FLIR SYSTEMS, INC., Wilsonville, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 5/24 (2006.01); G01J 5/04 (2006.01); G01J 5/02 (2006.01); G01J 5/20 (2006.01); G01J 5/08 (2006.01); G01J 5/00 (2006.01);
U.S. Cl.
CPC ...
G01J 5/24 (2013.01); G01J 5/024 (2013.01); G01J 5/046 (2013.01); G01J 5/0853 (2013.01); G01J 5/20 (2013.01); G01J 2005/0077 (2013.01);
Abstract

Systems and methods may be provided for forming enhanced infrared absorption microbolometers. An enhanced infrared absorption microbolometer may include a metal cap formed from a thin layer of oxidizing metal such as titanium and/or a titanium oxide. The metal cap may be formed within a bridge portion of the microbolometer. The bridge portion may include other layers such as first and second absorber layers disposed on opposing sides of a layer of temperature sensitive resistive material. The layer of temperature sensitive resistive material may be located between the metal cap and a reflecting metal layer formed on a readout integrated circuit for the microbolometer.


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