The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2018
Filed:
Mar. 15, 2017
Ngk Insulators, Ltd., Nagoya, JP;
Shinsuke Yano, Nagoya, JP;
Keiichiro Watanabe, Kasugai, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
Provided is a sensor node package where the breakage of a package member and/or a lid member due to thermal stress is reduced. The Young's modulus (220 GPa or less) of the package member, the thermal expansion coefficient (2 to 12 ppm/° C.) of the package member, the difference (5 ppm/° C. or less) in thermal expansion coefficient between the package member and the lid member, and the thickness (3 mm or less) of the lid member are adapted respectively to fall within predetermined ranges, thereby making it possible for the breakage of the package member and/or lid member due to thermal stress to be reduced effectively.