The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Sep. 28, 2017
Applicant:

Global Heat Transfer Ulc, Edmonton, CA;

Inventors:

Randy Vanberg, Tomball, TX (US);

Hamid Reza Zareie Rajani, Edmonton, CA;

Seyed Reza Larimi, Edmonton, CA;

Morteza Abbasi, Edmonton, CA;

Assignee:

Global Heat Transfer ULC, Edmonton, CA;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B60H 1/00 (2006.01); F24F 11/00 (2018.01); F24F 11/02 (2006.01); F24D 19/10 (2006.01); F28F 27/00 (2006.01); F24H 9/20 (2006.01);
U.S. Cl.
CPC ...
F24F 11/0086 (2013.01); F24D 19/10 (2013.01); F24F 11/001 (2013.01); F24F 11/006 (2013.01); F24F 11/02 (2013.01); F24H 9/20 (2013.01); F28F 27/00 (2013.01); F24F 2011/0061 (2013.01); F24F 2011/0063 (2013.01); F24F 2011/0091 (2013.01);
Abstract

A monitored heat exchanger system that includes a heat exchanger unit in operable engagement with a heat generating device, with an at least one service fluid being transferable therebetween, and a monitoring module coupled to the heat exchanger unit. The monitoring module includes a primary microcontroller in operable communication with an at least one sensor assembly. The at least one sensor assembly includes a mounting frame; a support platform; a circuit board; an inner sensor housing configured to extend out and around the circuit board and the support platform; a first magnet coupled to an underside of the inner sensor housing; and a rotating member comprising a plurality of blades, the rotating member being disposed on top of the inner sensor housing.


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