The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2018
Filed:
Sep. 12, 2014
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Hye Yeon Cha, Suwon-Si, KR;
Dong Hwan Lee, Suwon-Si, KR;
Jung Hyuk Jung, Suwon-Si, KR;
Chan Yoon, Suwon-Si, KR;
Hye Min Bang, Suwon-Si, KR;
Tae Young Kim, Suwon-Si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 5/00 (2006.01); H01F 27/24 (2006.01); C25D 7/00 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 27/29 (2006.01); H01F 41/04 (2006.01); C25D 5/02 (2006.01); C25D 5/10 (2006.01); C25D 5/16 (2006.01);
U.S. Cl.
CPC ...
C25D 7/001 (2013.01); C25D 5/02 (2013.01); C25D 5/10 (2013.01); C25D 5/16 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/292 (2013.01); H01F 41/046 (2013.01);
Abstract
There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.