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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9944840 B1

PDFFull Text
Date of Patent:
Apr. 17, 2018

Filed:

Jul. 08, 2013

Method of producing heat conductive sheet

Applicant:

Dexerials Corporation, Tokyo, JP;

Inventor:

Keisuke Aramaki, Utsunomiya, JP;

Assignee:

DEXERIALS CORPORATION, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Richard Chang

Int. Cl.
CPC ...
B29C 47/00 (2006.01); C09K 5/14 (2006.01); C08J 5/18 (2006.01); H05K 7/20 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01); B29D 7/01 (2006.01); F28F 21/02 (2006.01); B29C 43/02 (2006.01); B29C 47/08 (2006.01); B29K 83/00 (2006.01); B29K 505/00 (2006.01); B29K 507/04 (2006.01); B29K 509/02 (2006.01); B29K 509/08 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); B29C 43/02 (2013.01); B29C 47/004 (2013.01); B29C 47/0019 (2013.01); B29D 7/01 (2013.01); C08J 5/18 (2013.01); F28F 21/02 (2013.01); H01L 21/4878 (2013.01); H01L 23/3737 (2013.01); H05K 7/20481 (2013.01); B29C 47/0066 (2013.01); B29C 47/0869 (2013.01); B29C 2793/0027 (2013.01); B29K 2083/005 (2013.01); B29K 2505/00 (2013.01); B29K 2507/04 (2013.01); B29K 2509/02 (2013.01); B29K 2509/08 (2013.01); B29K 2995/0013 (2013.01); C08J 2383/04 (2013.01); C08J 2383/05 (2013.01); C08J 2383/07 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/31663 (2015.04);
Abstract

A method of producing a heat conductive sheet includes: a step (A) of dispersing a fibrous filler and a spherical filler in a binder resin to prepare a heat conductive sheet-forming composition; a step (B) of forming a molded block using the prepared heat conductive sheet-forming composition; a step (C) of slicing the formed molded block to a desired thickness to form a sheet; and a step (D) of pressing the sliced surface of the formed sheet, the sliced surface being pressed such that the thermal resistance value of the sheet after pressing becomes lower than the thermal resistance value of the sheet before pressing.

Find Patent Forward Citations

Aramaki, Keisuke. (2018). Method of producing heat conductive sheet (U.S. Patent No. 9944840). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9944840

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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