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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9944760 B1

PDFFull Text
Date of Patent:
Apr. 17, 2018

Filed:

Feb. 18, 2015

Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereof

Applicants:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Nippon Kayaku Kabushiki Kaisha, Tokyo, JP;

Inventors:

Toshio Shiobara, Tokyo, JP;

Junichi Sawada, Gunma, JP;

Miyuki Wakao, Gunma, JP;

Tsutomu Kashiwagi, Gunma, JP;

Naofusa Miyagawa, Tokyo, JP;

Yoshihiro Kawada, Tokyo, JP;

Chie Sasaki, Tokyo, JP;

Naosuke Taniguchi, Tokyo, JP;

Assignees:

Shin-Etsu Chemical Co., Ltd., , JP;

Nippon Kayaku Kabushiki Kaisha, , JP;

Attorney:

Wood, Philips, Katz, Clark & Mortimer

Primary Examiner:

Marc S Zimmer

Int. Cl.
CPC ...
C08G 77/50 (2006.01); C08G 77/14 (2006.01); C08G 77/38 (2006.01); C08G 59/34 (2006.01); C08G 59/40 (2006.01); C08G 59/02 (2006.01); C08G 59/30 (2006.01); C08G 59/32 (2006.01); C09J 183/14 (2006.01); C08G 59/42 (2006.01); C08G 59/68 (2006.01); C08G 77/20 (2006.01);
U.S. Cl.
CPC ...
C08G 77/50 (2013.01); C08G 59/027 (2013.01); C08G 59/306 (2013.01); C08G 59/3281 (2013.01); C08G 59/34 (2013.01); C08G 59/40 (2013.01); C08G 59/4215 (2013.01); C08G 59/4276 (2013.01); C08G 59/4284 (2013.01); C08G 59/688 (2013.01); C08G 77/14 (2013.01); C08G 77/20 (2013.01); C08G 77/38 (2013.01); C09J 183/14 (2013.01);
Abstract

The purpose of the present invention is to provide a silicone-modified epoxy resin which produces a cured product having excellent low gas permeability and strength; a composition of the resin; and an epoxy resin cured product obtainable by curing the composition. Disclosed is an epoxy resin represented by the following Formula (1):

Find Patent Forward Citations

Shiobara, Toshio. (2018). Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereof (U.S. Patent No. 9944760). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9944760

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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