The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2018
Filed:
Feb. 14, 2012
Yukio Nishikawa, Osaka, JP;
Tomomi Tanaka, Osaka, JP;
Toshiki Itoi, Nara, JP;
Yoshiaki Kobayashi, Osaka, JP;
Yukio Nishikawa, Osaka, JP;
Tomomi Tanaka, Osaka, JP;
Toshiki Itoi, Nara, JP;
Yoshiaki Kobayashi, Osaka, JP;
Abstract
Provided are a laser-bonded component and a production method for same that ensure sufficient bonding strength using little laser energy and which cause little increase in surrounding temperature. A nickel layer, being a surface layer, is formed having sufficient thickness on the upper surface of a copper plate that is uppermost amongst at least two superposed copper plates, a laser is irradiated from above the nickel layer, a re-solidification section formed by fusing and alloying the copper in the copper plates and the nickel in the nickel layer is formed through to inside the bottommost copper plate, and the copper plates are bonded together. The re-solidification section having high breaking strength is formed by the alloying of the nickel and the copper. As a result, the copper plates can be bonded with a small welding surface area and little laser energy.