The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

May. 04, 2012
Applicants:

R. Byron Pipes, Lafayette, IN (US);

Ian Cameron Coker, Victoria, AU;

Douglas Edward Adams, West Lafayette, IN (US);

Ronald Sterkenburg, West Lafayette, IN (US);

Jeffrey P. Youngblood, Crawfordsville, IN (US);

Inventors:

R. Byron Pipes, Lafayette, IN (US);

Ian Cameron Coker, Victoria, AU;

Douglas Edward Adams, West Lafayette, IN (US);

Ronald Sterkenburg, West Lafayette, IN (US);

Jeffrey P. Youngblood, Crawfordsville, IN (US);

Assignee:

PURDUE RESEARCH FOUNDATION, West Lafayette, IN (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 73/10 (2006.01); B29C 73/02 (2006.01); B29C 70/44 (2006.01); B29C 73/12 (2006.01); B29C 73/34 (2006.01); B29C 35/02 (2006.01); B29C 73/26 (2006.01);
U.S. Cl.
CPC ...
B29C 73/02 (2013.01); B29C 70/443 (2013.01); B29C 73/10 (2013.01); B29C 73/12 (2013.01); B29C 35/02 (2013.01); B29C 73/34 (2013.01); B29C 2073/262 (2013.01);
Abstract

The present disclosure provides a method of repairing a damaged portion of a panel formed of composite material. The method includes preparing the damaged portion for repair and applying a pressure responsive adhesive layer to substantially cover the damaged portion. The method also includes disposing a vacuum-assisted resin transfer molding repair patch assembly to substantially cover the damaged portion and substantially covering the repair patch assembly with a vacuum bag assembly. Resin is introduced into and impregnates the repair patch assembly. The repair patch assembly is cured after being impregnated.


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