The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Dec. 26, 2011
Applicants:

Takashi Tokunaga, Satsumasendai, JP;

Hideyoshi Kinoshita, Satsumasendai, JP;

Inventors:

Takashi Tokunaga, Satsumasendai, JP;

Hideyoshi Kinoshita, Satsumasendai, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23B 27/14 (2006.01); C22C 29/04 (2006.01); C22C 29/02 (2006.01); C22C 1/05 (2006.01); B22F 5/00 (2006.01);
U.S. Cl.
CPC ...
B23B 27/148 (2013.01); C22C 1/051 (2013.01); C22C 29/02 (2013.01); B22F 2005/001 (2013.01); B23B 2222/16 (2013.01); Y10T 407/27 (2015.01);
Abstract

A cutting tool composed of a sintered cermet body is disclosed. The body includes hard phases composed of carbide(s), nitride(s), and carbonitride(s) of metal(s) selected from metals belonging to Groups 4, 5, and 6 of the periodic table including Ti as a main component, and includes first and second hard phases, and a binding phase mainly composed of at least one of Co and Ni. The body includes first and second faces, a cutting edge located at an edge of the first and second faces, and an interior portion located at a depth of 400 μm or more from the first face. When residual stresses are measured by a 2D method, stress of the first hard phase is 80 MPa or more in terms of compressive stress. Stresses of the second hard phase and the binding phase are −50 MPa to 50 Mpa in terms of compressive or tensile stress.


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