The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Jun. 17, 2015
Applicant:

Shoei Chemical Inc., Tokyo, JP;

Inventors:

Yuji Akimoto, Tosu, JP;

Hideki Tanaka, Tosu, JP;

Mineto Iwasaki, Tosu, JP;

Akiko Matsuo, Tosu, JP;

Assignee:

SHOEI CHEMICAL INC., Shinjuku-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 9/14 (2006.01); B22F 1/02 (2006.01); B22F 9/12 (2006.01); B22F 9/04 (2006.01); C22C 9/00 (2006.01); C22C 5/06 (2006.01); C22C 19/00 (2006.01); B22F 1/00 (2006.01); H01G 4/008 (2006.01); B23K 1/00 (2006.01); H01F 27/28 (2006.01); B23K 35/02 (2006.01); C22C 19/03 (2006.01); H01G 4/012 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); H01F 41/04 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
B22F 9/14 (2013.01); B22F 1/0003 (2013.01); B22F 1/0014 (2013.01); B22F 1/0074 (2013.01); B22F 1/0085 (2013.01); B22F 1/02 (2013.01); B22F 9/04 (2013.01); B22F 9/12 (2013.01); B23K 1/0016 (2013.01); B23K 35/025 (2013.01); C22C 5/06 (2013.01); C22C 9/00 (2013.01); C22C 19/002 (2013.01); C22C 19/03 (2013.01); H01F 27/2804 (2013.01); H01G 4/008 (2013.01); H01G 4/0085 (2013.01); B22F 2301/10 (2013.01); B22F 2301/15 (2013.01); B22F 2302/40 (2013.01); B22F 2302/45 (2013.01); B22F 2303/40 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B23K 35/3033 (2013.01); B23K 35/3612 (2013.01); B23K 35/3613 (2013.01); H01F 41/041 (2013.01); H01F 2027/2809 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01);
Abstract

A carbon-coated metal powder having few impurities, a narrower particle size distribution, and sintering properties is particularly suitable as a conductive powder of a conductive paste for forming internal conductors in a ceramic multilayer electronic component obtained by co-firing multilayered ceramic sheets and internal conductor layers; a conductive paste containing the carbon-coated metal powder; a multilayer electronic component using the conductive paste; and a method for manufacturing the carbon-coated metal powder. The carbon-coated metal powder has specific properties in TMA or ESCA measurements. The carbon-coated metal powder can be obtained by melting and vaporizing a metallic raw material in a reaction vessel, conveying the generated metal vapor into a cooling tube and rapidly cooling the metal vapor by endothermically decomposing a carbon source supplied into the cooling tube, and forming a carbon coating film on metal nuclei surfaces in parallel with generation of the metal nuclei.


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