The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Apr. 28, 2014
Applicant:

Kao Corporation, Chuo-ku, JP;

Inventors:

Kouhei Yamada, Sumida-ku, JP;

Atsushi Tomokuni, Shinagawa-ku, JP;

Koji Tanaka, Shinagawa-ku, JP;

Daisuke Sawa, Sumida-ku, JP;

Takashi Kawai, Koto-ku, JP;

Assignee:

KAO CORPORATION, Chuo-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 3/18 (2006.01); C11D 3/20 (2006.01); A61K 8/31 (2006.01); A61K 8/33 (2006.01); A61K 8/36 (2006.01); A61K 8/81 (2006.01); A61K 8/92 (2006.01); A61Q 1/14 (2006.01); A61Q 19/00 (2006.01); A61Q 19/10 (2006.01); A61K 8/02 (2006.01);
U.S. Cl.
CPC ...
A61Q 1/14 (2013.01); A61K 8/0208 (2013.01); A61K 8/31 (2013.01); A61K 8/33 (2013.01); A61K 8/8152 (2013.01); A61Q 19/10 (2013.01);
Abstract

Provided is a skin cleansing composition comprising the following components (A), (B), (C), (D), and (E): (A) 0.1 to 25 mass % of an ether oil which is in a liquid state at 25° C., (B) 0.003 to 1 mass % of a water-soluble polymer comprising acrylic acid or methacrylic acid as a constitutional unit, (C) 1 to 30 mass % of a hydrocarbon oil having a viscosity of 15 mPa·s or lower at 30° C., (D) 60 to 95 mass % of water, and (E) 0.49 mass % or less of a nonionic surfactant having an HLB of larger than 9, wherein the mass ratio of the component (B) to the component (A), (B)/(A) is from 0.0001 to 0.1, and the mass ratio between the component (A) and the component (C), (A)/((A)+(C)) is from 0.05 to 0.9.


Find Patent Forward Citations

Loading…