The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Jun. 25, 2015
Applicant:

Rf Micro Devices, Inc., Greensboro, NC (US);

Inventors:

Thomas Scott Morris, Lewisville, NC (US);

Ulrik Riis Madsen, Norresundby, DK;

Donald Joseph Leahy, Kernersville, NC (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H05K 3/40 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 9/00 (2006.01); H05K 3/30 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4038 (2013.01); H01L 23/49827 (2013.01); H01L 23/552 (2013.01); H05K 1/115 (2013.01); H05K 3/301 (2013.01); H05K 9/0024 (2013.01); H01L 21/561 (2013.01); H01L 24/97 (2013.01); H01L 2924/1461 (2013.01); H05K 2201/0715 (2013.01); Y10T 29/49165 (2015.01);
Abstract

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.


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