The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Sep. 30, 2016
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Kazuharu Kitatani, Tokyo, JP;

Yasunobu Noguchi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/11 (2013.01); H05K 3/34 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10257 (2013.01); H05K 2201/10272 (2013.01);
Abstract

A circuit board includes a base substrate, a busbar disposed on a mounting surface of the base substrate; and an electronic component disposed on the mounting surface and including a plurality of terminals. At least one of the terminals is soldered to a component connecting end portion extending from the busbar. The base substrate has an opening into which the component connecting end portion is inserted. A first insertion portion is provided in the component connecting end portion. The terminal is inserted through the first insertion portion. The busbar is fixed to the base substrate so that the component connecting end portion is inserted into the opening with a soldering surface positioned closer to a rear surface of the base substrate than the component mounting surface. The soldering surface is on a side of the component connecting end portion where the terminal inserted through the first insertion portion protrudes.


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