The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
Feb. 20, 2015
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H01L 23/3677 (2013.01); H01L 23/49822 (2013.01); H01L 23/5389 (2013.01); H05K 1/0204 (2013.01); H05K 1/0206 (2013.01); H05K 1/0298 (2013.01); H05K 1/181 (2013.01); H05K 3/0094 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15313 (2013.01); H05K 1/185 (2013.01); H05K 3/4602 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09536 (2013.01); H05K 2201/09845 (2013.01);
Abstract
Disclosed is a printed circuit board including a base insulating layer, an upper insulating layer formed on the base insulating layer, a lower insulating layer formed under the base insulating layer. The upper insulating layer has a plurality of first vias filled in the first through holes, respectively, and the lower insulating layer has a second via filled in one second through hole formed through a top and a bottom surface and commonly connected with the first vias.