The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Nov. 03, 2015
Applicants:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Research & Business Foundation Sungkyunkwan University, Suwon-si, KR;

Inventors:

Kyung-wan Park, Suwon-si, KR;

Shi-yun Cho, Anyang-si, KR;

Hyo-young Lee, Suwon-si, KR;

Hyun-jung Kim, Suwon-si, KR;

Mee-ree Kim, Suwon-si, KR;

Ik-joon Kim, Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); B32B 7/04 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 27/40 (2006.01); B32B 3/08 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0283 (2013.01); B32B 3/08 (2013.01); B32B 7/045 (2013.01); B32B 27/08 (2013.01); B32B 27/281 (2013.01); B32B 27/283 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 27/40 (2013.01); H05K 1/097 (2013.01); H05K 3/389 (2013.01); B32B 2250/24 (2013.01); B32B 2255/10 (2013.01); B32B 2255/24 (2013.01); B32B 2262/103 (2013.01); B32B 2270/00 (2013.01); B32B 2307/202 (2013.01); B32B 2307/51 (2013.01); B32B 2307/546 (2013.01); B32B 2457/08 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/026 (2013.01);
Abstract

A flexible printed circuit board (PCB) has stretchability and durability. The flexible PCB includes: a first polymer substrate having flexibility, stretchability, or elasticity; a second polymer substrate having flexibility, stretchability, or elasticity; a conductive track disposed between the first and second polymer substrates and including metal nanowires; and a cured silane coupling agent which bonds the conductive track to at least one of the first and second polymer substrates.


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