The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
Jul. 28, 2015
Applicant:
Yazaki Corporation, Minato-ku, Tokyo, JP;
Inventor:
Masashi Suzuki, Makinohara, JP;
Assignee:
Yazaki Corporation, Minato-ku, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); H05K 1/0201 (2013.01); H05K 1/181 (2013.01); H05K 1/0207 (2013.01); H05K 2201/09972 (2013.01);
Abstract
A heatsink-less electronic unit includes a metal coreless electronic substrate, a heatsink-less microcomputer and various semiconductor relays. The heatsink-less microcomputer and the various semiconductor relays are mounted on the metal coreless electronic substrate. The heatsink-less microcomputer is arranged on the metal coreless electronic substrate. Among the various semiconductor relays, the one which may reach the highest temperature is separated at a longest distance from a location where the heatsink-less microcomputer is arranged, and the various semiconductor relays are arranged separately from one another.