The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
Feb. 29, 2016
Seiko Epson Corporation, Tokyo, JP;
Shuichi Tanaka, Chino, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
An electronic device includes a sealing plate including a first surface connected to a pressure chamber formation substrate, and a second surface having a drive IC provided thereon. The sealing plate includes a first region in which a plurality of individual connection terminals are arranged, and a second region in a position different from the first region. A plurality of bump electrodes are arranged at a pitch different from a pitch of an individual connection terminals, in a region overlapping a second region, and a wiring group connecting the individual connection terminal and a bump electrode includes a first wiring of which a position of a pass-through wiring relaying the first surface and the second surface is within the first region. A second wiring of which a position of a pass-through wiring connecting the first surface and the second surface is within the second region.