The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Oct. 28, 2016
Applicant:

Nichia Corporation, Anan-shi, JP;

Inventor:

Daisuke Kishikawa, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/00 (2006.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 13/04 (2006.01); H01L 33/54 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); H01L 33/62 (2013.01); H05K 1/181 (2013.01); H05K 3/303 (2013.01); H05K 13/0404 (2013.01); H01L 33/54 (2013.01); H01L 33/642 (2013.01); H01L 2224/16225 (2013.01); H01L 2933/0066 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A light emitting device includes a wiring board, a light emitting element, and a protection film. The wiring board includes a base member, and positive and negative wiring layer parts. The positive and negative wiring layer parts are arranged on or above the upper surface of the base member. The light emitting element is mounted on the wiring layer parts in a flip-chip manner. The protection film covers the base member, the wiring layer parts and the light emitting element, and is formed of an inorganic material for serving as the exterior surface of the light emitting device. Each of the wiring layer parts has a curved outer-side edge. The curvature of the outer-side edge is substantially constant.


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