The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Jun. 17, 2016
Applicant:

John J. Daniels, Madison, CT (US);

Inventor:

John J. Daniels, Madison, CT (US);

Assignee:

ARTICULATED TECHNOLOGIES, LLC, Hobe Sound, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/56 (2010.01); H01L 23/00 (2006.01); H01L 33/64 (2010.01); F21Y 115/10 (2016.01); H01L 25/075 (2006.01); H01L 33/48 (2010.01); F21Y 105/10 (2016.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); H01L 24/00 (2013.01); F21Y 2105/10 (2016.08); F21Y 2115/10 (2016.08); H01L 25/0753 (2013.01); H01L 33/486 (2013.01); H01L 33/641 (2013.01);
Abstract

A bottom electrically conductive surface is disposed on the top surface of a substrate and a top electrically conductive surface disposed on the bottom surface of a superstrate. A bare die electronic device is disposed with at least one of its top conductor in direct electrical communication with the bottom electrically conductive surface and/or its bottom conductor in direct electrical communication with the top conductive surface. A non-conductive adhesive secures the substrate to the superstrate so that the bare die electronic device is retained in direct electrical communication. The non-conductive adhesive has a melting point temperature at least greater than a minimum operating temperature of the operating temperature range of the bare die, so that the non-conductive adhesive does not melt and flow thereby preventing a separation or degradation of the direct electrical connection of the bare die electronic device.


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