The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
May. 08, 2013
Applicant:
Material Concept, Inc., Sendai-shi, Miyagi, JP;
Inventors:
Junichi Koike, Sendai, JP;
Hoang Tri Hai, Sendai, JP;
Assignee:
MATERIAL CONCEPT, INC., Miyagi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 31/02 (2006.01); C22C 9/00 (2006.01); H01B 1/22 (2006.01); H01L 31/0224 (2006.01); B22F 1/00 (2006.01); H05K 1/09 (2006.01); H01B 1/02 (2006.01); H05K 3/12 (2006.01); C22C 1/04 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02013 (2013.01); B22F 1/0011 (2013.01); B22F 1/0059 (2013.01); C22C 9/00 (2013.01); H01B 1/026 (2013.01); H01B 1/22 (2013.01); H01L 31/022425 (2013.01); H05K 1/092 (2013.01); H05K 3/1291 (2013.01); C22C 1/0425 (2013.01); H05K 2201/0245 (2013.01); H05K 2201/0248 (2013.01); H05K 2201/0266 (2013.01); H05K 2203/1131 (2013.01); Y02E 10/50 (2013.01); Y10T 428/2982 (2015.01);
Abstract
This conductive paste is such that the printing properties and sintering properties are superior and is formed such that resistance of wiring after sintering is lowered. This conductive paste is characterized by being formed from copper-based metal particles and by an aspect ratio (dmax/dmin), which is defined as the ratio of the maximum diameter (dmax) and minimum diameter (dmin) for the metal particles, being greater than or equal to 1.0 and smaller than 2.2.