The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
Jan. 06, 2016
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Nobutoshi Fujii, Kanagawa, JP;
Kenichi Aoyagi, Kanagawa, JP;
Yoshiya Hagimoto, Kanagawa, JP;
Hayato Iwamoto, Kanagawa, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/146 (2006.01); H01L 25/00 (2006.01); H01L 31/18 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14687 (2013.01); H01L 25/50 (2013.01); H01L 27/1464 (2013.01); H01L 27/1469 (2013.01); H01L 27/14634 (2013.01); H01L 27/14683 (2013.01); H01L 27/14689 (2013.01); H01L 31/1876 (2013.01); H01L 25/0657 (2013.01); H01L 2924/0002 (2013.01); Y02E 10/50 (2013.01); Y02P 70/521 (2015.11);
Abstract
The present technology includes: bonding a device formation side of a first substrate having a first device and a device formation side of a second substrate having a second device in opposition to each other; forming a protective film on at least an edge of the second substrate having the second device; and reducing a thickness of the first substrate.