The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
Sep. 22, 2016
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Hiroyasu Matsugai, Kanagawa, JP;
Kiyotaka Tabuchi, Kumamoto, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 21/66 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14634 (2013.01); H01L 21/76898 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); H01L 23/562 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 27/1469 (2013.01); H01L 27/14636 (2013.01); H01L 27/0688 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/16 (2013.01); H01L 2224/24147 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/8203 (2013.01); H01L 2224/92 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/13091 (2013.01);
Abstract
A semiconductor device includes a first semiconductor substrate, a second semiconductor substrate, a first main surface side of the first semiconductor substrate and a first main surface side of the second semiconductor substrate being bonded to each other; and a warpage correction layer which is formed on at least one or more selected from the first main surface side of the first semiconductor substrate, the first main surface side of the second semiconductor substrate, a second main surface side of the first semiconductor substrate, and a second main surface side of the second semiconductor substrate.