logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9941242 B1

PDFFull Text
Date of Patent:
Apr. 10, 2018

Filed:

Oct. 11, 2016

Unpacked structure for power device of radio frequency power amplification module and assembly method therefor

Applicant:

Innogration (Suzhou) Co., Ltd., Jiangsu, CN;

Inventor:

Gordon Chiang Ma, Jiangsu, CN;

Assignee:

INNOGRATION (SUZHOU) CO., LTD., Jiangsu, CN;

Attorney:

RatnerPrestia

Primary Examiner:

Dion R Ferguson

Assistant Examiner:

Mandeep S Buttar

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H03F 3/195 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H01L 23/053 (2006.01); H01L 23/367 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 21/4871 (2013.01); H01L 23/053 (2013.01); H01L 23/3675 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/49 (2013.01); H03F 3/195 (2013.01); H05K 1/021 (2013.01); H05K 1/183 (2013.01); H01L 24/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6644 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/85801 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/3025 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10166 (2013.01); H05K 2203/049 (2013.01);
Abstract

A power device without a package structure in a radio frequency power amplifier module and an assembly method for a radio frequency power amplifier module are provided. The radio frequency power amplification module includes the power device, a heat dissipating plate and a printed circuit board. The power device includes a carrier flange, a plurality of electronic elements and bond-wires, and the electronic elements are adhered to the carrier flange, the power device and the printed circuit board are fixed on the heat dissipating plate, the electronic elements of the power device are connected with each other through the bond-wires, and the electronic elements are directly connected to the printed circuit board through the bond-wires. The electronic elements include at least one passive device, a decoupling capacitor is disposed on the printed circuit board, and the decoupling capacitor is connected to the passive device through the bond-wires.

Find Patent Forward Citations

Quick Actions:

Ma, Gordon. (2018). Unpacked structure for power device of radio frequency power amplification module and assembly method therefor (U.S. Patent No. 9941242). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9941242

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…