The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

May. 20, 2016
Applicant:

Ut-battelle, Llc, Oak Ridge, TN (US);

Inventor:

Zhenxian Liang, Knoxville, TN (US);

Assignee:

UT-Battelle, LLC, Oak Ridge, TN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/473 (2006.01); H01L 25/18 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 23/538 (2006.01); H01L 23/467 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 23/3677 (2013.01); H01L 23/3735 (2013.01); H01L 23/4006 (2013.01); H01L 23/473 (2013.01); H01L 23/5385 (2013.01); H01L 24/33 (2013.01); H01L 25/18 (2013.01); H01L 23/467 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/8383 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83825 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/13091 (2013.01); H02M 7/003 (2013.01);
Abstract

An integrated double sided cooled power module has one or multiple phase legs configuration including one or more planar power packages, each planar power package having an upper power switch unit and a lower power switch unit directly bonded and interconnected between two insulated power substrates, and further sandwiched between two heat exchangers via direct bonds. A segmented coolant manifold is interposed with the one or more planar power packages and creates a sealed enclosure that defines a coolant inlet, a coolant outlet and a coolant flow path between the inlet and the outlet. A coolant circulates along the flow path to remove heat and increase the power density of the power module.


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