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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9941227 B1

PDFFull Text
Date of Patent:
Apr. 10, 2018

Filed:

May. 26, 2016

Impedance matching configuration

Applicant:

Ampleon Netherlands B.v., Nijmegen, NL;

Inventors:

Yi Zhu, Nijmegen, NL;

Josephus Van Der Zanden, Nijmegen, NL;

Iouri Volokhine, Nijmegan, NL;

Rob Mathijs Heeres, Nijmegen, NL;

Assignee:

Ampleon Netherlands B.V., Nijmegen, NL;

Attorney:

McDonnell Boehnen Hulbert and Berghoff LLP

Primary Examiner:

Victor A Mandala

Assistant Examiner:

Regan J Rundio

Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/48 (2006.01); H03F 3/191 (2006.01); H03H 7/38 (2006.01); H01L 23/00 (2006.01); H03F 1/56 (2006.01); H03F 3/195 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 24/06 (2013.01); H01L 24/49 (2013.01); H03F 1/565 (2013.01); H03F 3/195 (2013.01); H01L 24/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6666 (2013.01); H01L 2223/6672 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/30111 (2013.01); H03F 2200/451 (2013.01);
Abstract

A package is provided. The package comprises a die and an impedance matching network. The die has a first terminal and a second terminal. The impedance matching network is coupled to the second terminal and comprises a first inductor and a first capacitor. The first inductor comprises first bond wire connections coupled between the second terminal and a first bond pad on the die, and second bond wire connections coupled between the first bond pad and a second bond pad coupled to the first capacitor.

Find Patent Forward Citations

Zhu, Yi. (2018). Impedance matching configuration (U.S. Patent No. 9941227). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9941227

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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