The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Mar. 14, 2016
Applicant:

Ams International Ag, Rapperswil-Jona, CH;

Inventors:

Roel Daamen, Herkenbosch, NL;

Robertus Adrianus Maria Wolters, Eindhoven, NL;

Rene Theodora Hubertus Rongen, Nijmegen, NL;

Youri Victorovitch Ponomarev, Leuven, BE;

Assignee:

ams International AG, Rapperswil-Jona, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 23/00 (2006.01); B81C 1/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); B81C 1/00246 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 22/34 (2013.01); H01L 23/3192 (2013.01); H01L 23/49811 (2013.01); B81C 2203/0714 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Disclosed is an integrated circuit comprising a substrate carrying a plurality of circuit elements; a metallization stack interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion; a passivation stack covering the metallization stack; and a sensor including a sensing material on the passivation stack, said sensor being coupled to the first metal portion by a via extending through the passivation stack. A method of manufacturing such an IC is also disclosed.


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