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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9941197 B1

PDFFull Text
Date of Patent:
Apr. 10, 2018

Filed:

Jun. 15, 2015

Strip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type, electronic device with a module of this type, and method for producing a substrate

Applicant:

Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;

Inventors:

Eckhard Ditzel, Linsengericht, DE;

Siegfried Walter, Gelnhausen, DE;

Michael Benedikt, Neuberg, DE;

Udo Becker, Steinau, DE;

Assignee:

HERAEUS DEUTSCHLAND GMBH & CO. KG, Hanau, DE;

Attorneys:

Hassan Abbas Shakir

Katten Muchin Rosenman LLP

Primary Examiner:

Luan C Thai

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/66 (2006.01); G06K 19/07 (2006.01); G06K 19/077 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49855 (2013.01); G06K 19/07 (2013.01); G06K 19/07749 (2013.01); H01L 21/4842 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/49503 (2013.01); H01L 23/49548 (2013.01); H01L 23/49551 (2013.01); H01L 23/49582 (2013.01); H01L 23/49861 (2013.01); H01L 23/562 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 23/3107 (2013.01); H01L 23/49541 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6677 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/013 (2013.01); H01L 2924/1711 (2013.01); H01L 2924/1776 (2013.01); H01L 2924/17747 (2013.01); H01L 2924/18301 (2013.01);
Abstract

A strip-shaped substrate made from a film includes a plurality of units for producing chip carriers. Each unit has a chip island for fixing a semiconductor chip, electrodes for electrical connection of the semiconductor chip, and through-openings for structuring the unit. At least one through-opening forms an anchoring edge for a casting compound for encapsulating the semiconductor chip. A surface section of the film abutting the through-opening is chamfered to form the anchoring edge. The anchoring edge protrudes past the side of the film on which the chip island is arranged.

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