The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Jan. 24, 2017
Applicants:

Stmicroelectronics (Crolles 2) Sas, Crolles, FR;

Socpra Sciences ET Génie S.e.c., Sherbrooke, CA;

Inventors:

Louis-Michel Collin, Saint-Jean-sur-Richelieu, CA;

Luc Guy Frechette, Sherbrooke, CA;

Sandrine Lhostis, Thonon les Bains, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/42 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/42 (2013.01); H01L 21/481 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 23/3672 (2013.01); H01L 23/49811 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13078 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/14151 (2013.01); H01L 2224/14154 (2013.01); H01L 2224/14177 (2013.01); H01L 2224/27462 (2013.01); H01L 2224/29013 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/30151 (2013.01); H01L 2224/73103 (2013.01); H01L 2224/73203 (2013.01);
Abstract

An assembly includes an integrated circuit chip and a plate with at least one heat removal channel arranged between the chip and the plate. Metal sidewalls are formed to extend from one surface of the chip to an opposite surface of the plate. The assembly is encapsulated in a body that includes an opening extending to reach the channel. The plate may be one of an interposer, an integrated circuit chip, a support of surface-mount type, or a metal plate.


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